Board-to-Board Connectors Market

Board-to-Board Connectors Market by Type (Pin Headers, and Sockets), Pin Headers (Stacked & Shrouded) Pitch (Less Than 1 mm, 1 mm to 2 mm, Greater Than 2 mm), Application (Consumer Electronics, Industrial Automation) and Region - Global Forecast to 2028

Report Code: SE 8727 Jul, 2023, by marketsandmarkets.com

[210 Pages Report] The global board-to-board connectors was valued at USD 11.6 billion in 2023 and is estimated to reach USD 15.4 billion by 2028, registering a CAGR of 5.8% during the forecast period. The increasing demand for electronic devices is driving the growth of the board-to-board connectors market. With the rising adoption of smartphones, tablets, wearables, IoT devices, and other electronic systems, there is a need for efficient interconnectivity solutions. Technological advancements in areas such as telecommunications, automotive, industrial automation, healthcare, and consumer electronics require advanced board-to-board connectors.

Board-to-Board Connectors Market

Board-to-Board Connectors Market

Board-to-Board Connectors Market Forecast to 2028

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Market Dynamics:

Driver: Rapid technological advancements in several applications such as electronics and telecommunications

Rapid technological advancements in several applications such as electronics and telecommunications is a significant driver of the board-to-board connectors market. The continuous evolution of electronic devices and advancements in various industries necessitate the use of advanced connectors to meet the ever-increasing connectivity demands. In consumer electronics, smartphones, tablets, and wearable devices constantly evolve with new features and functionalities. These advancements require smaller, more efficient board-to-board connectors that accommodate complex circuitry while maintaining reliable interconnections. As devices become slimmer and more compact, the connectors must follow suit, enabling seamless communication between PCBs within the limited space. Thus, the rapid technological advancements across various industries drive the need for board-to-board connectors as they meet the demands for miniaturization, high-speed data transfer, signal integrity, and reliable interconnections to enable seamless integration and support the advancement of technology in the modern world.

Restraint: Technological complexities involved while developing application-specific board-to-board connectors

Each application has unique requirements for board-to-board connectors regarding signal integrity, power transmission, size constraints, environmental conditions, and mechanical considerations. Designing and developing connectors that meet these specific requirements can be complex and time-consuming. Additionally, the rapid pace of technological advancements and the need for customization for different applications and industries further contribute to the restraints.

Opportunity: Growing Adoption of IoT and Edge computing

The increasing adoption of IoT devices and edge computing solutions drives the demand for board-to-board connectors to support connectivity between devices, sensors, and edge computing modules. This provides opportunities for connectors with specific features like low power consumption, secure connections, and robust designs for IoT and edge computing applications. For example, edge computing is utilized in the industrial sector for real-time monitoring and control of manufacturing processes. Board-to-board connectors enable the interconnection of sensors, actuators, and processing units, allowing efficient data transfer and decision-making at the edge of the network. In the innovative home sector, IoT devices such as smart thermostats, lighting systems, and security cameras rely on board-to-board connectors to establish connections between the control unit and various sensors or actuators distributed throughout the home.

Challenge: Large technical challenges related to signal integrity and high-speed data transmission

With increasing data transfer rates, ensuring reliable signal transmission with minimal loss, distortion, and interference becomes crucial. Factors such as insertion loss, reflection, crosstalk, impedance control, noise, EMI, skew, timing issues, material selection, and connector crosstalk all contribute to these challenges. Manufacturers must employ advanced design techniques, rigorous testing methodologies, and high-quality materials to address these challenges. Collaboration with customers and considering specific application requirements are key to delivering board-to-board connectors that meet the demanding needs of high-speed data transmission systems. Continuous investment in research and development is necessary to improve connector performance, optimize signal paths, and mitigate the effects of noise, interference, and transmission errors.

Board-To-Board Connectors Market Ecosystem

The Board-To-Board Connectors market is competitive, with major companies such as Amphenol Corporation, TE Connectivity, Japan Aviation Electronics, Hirose Electric Co Ltd, Molex, and numerous small- and medium-sized enterprises. Almost all players offer various products, including pin headers and sockets. These components are widely used in consumer electronics, automotive, telecommunications, industrial automation, healthcare, and others.

Board-to-Board Connectors Market by Ecosystem

Based on type socket segment is expected to have highest CAGR during the forecast period.

The sockets segment is growing at the highest CAGR in the board-to-board connectors market. Sockets offer a high degree of flexibility and interchangeability, allowing for easy replacement and reconfiguration of components. This feature is precious in industries where frequent changes or upgrades to electronic devices are common, such as consumer electronics or telecommunications. The board-to-board connectors are compatible with a wide range of board-to-board connectors, making them suitable for various applications and industries. Hence, the growth in industries such as consumer electronics is positively impacting the demand for sockets.

Based on pitch, the 1 mm to 2 mm segment is projected to largest market share during the forecast period

The 1 mm to 2 mm pitch connectors are known for their compact size, allowing for electronic device miniaturization. As devices become smaller and more lightweight, connectors with smaller pitches become crucial for enabling the integration of components within limited spaces. This is particularly important in applications where multiple signals, power lines, or data paths must be efficiently routed between boards or modules. These advantages over other pitch types positively impact 1 mm to 2 mm pitch board-to-board connectors.

Based on region, Asia Pacific is projected to grow fastest for the board-to-board connectors market

Many countries in the Asia Pacific region are actively pursuing smart manufacturing initiatives and adopting Industry 4.0 technologies. This includes the integration of automation, robotics, IoT, and data analytics in manufacturing processes. Board-to-board connectors play a crucial role in facilitating seamless connectivity and communication between different components in smart manufacturing systems, thereby driving the market growth.

Board-to-Board Connectors Market by Region

Board-to-Board Connectors Market by Region

To know about the assumptions considered for the study, download the pdf brochure

Key Market Players

The board-to-board connectors companies is dominated by a few globally established players such as Amphenol Corporation (US), TE Connectivity (Switzerland), Japan Aviation Electronics (Japan), Hirose Electric Co Ltd (Japan), Molex (US), Omron Corporation (Japan), Samtec (US), Harting Technology Group (Germany), FIT Hon Teng Limited (Taiwan), Kyocera Corporation (Japan), and CSCONN Corporation (China)

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Scope of the Report

Report Metric

Details

Market Size Availability for Years

2019–2028

Base Year

2022

Forecast Period

2023–2028

Forecast Units

Value (USD)

Segments Covered

By type, pitch, application, and region

Geographies Covered

North America, Europe, Asia Pacific, and Rest of the world

Companies Covered

Amphenol Corporation (US), TE Connectivity (Switzerland), Japan Aviation Electronics (Japan), Hirose Electric Co Ltd (Japan), Molex (US), Omron Corporation (Japan), Samtec (US), Harting Technology Group (Germany), FIT Hon Teng Limited (Taiwan), Kyocera Corporation (Japan), and CSCONN Corporation (China).

Board-to-Board Connectors Market Highlights

This research report categorizes the board-to-board connectors market based on type, pitch, and application, and region

Segment

Subsegment

Based on Type:

  • Pin Headers
    • Stacked Header
    • Shrouded Header
  • Socket

Based on Component:

  • Less than 1mm
  • 1mm to 2mm
  • Greater than 2mm

Based on end User:

  • Consumer Electronics
  • Industrial Automation
  • Telecommunication
  • Automotive
  • Healthcare
  • Others (Aerospace & Defense, Transportation, Energy & Power)

Based on Region:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • France
    • Rest of Europe
  • Asia Pacific (APAC)
    • China
    • Japan
    • South Korea
    • India
    • Rest of APAC
  • Rest of the world (RoW)
    • South America
    • Middle East and Africa

Recent Developments

  • In March 2023, Hirose Electric Co. Ltd.has introduced the IT14 Series, a hermaphroditic board-to-board connector that enables high-speed data transmission at up to 112Gbps using PAM4 technology. The release of the IT14 Series primarily aims to ensure a consistent and reliable supply of components for the telecommunications equipment market. This series is specifically designed to meet the demands and requirements of the telecommunications industry.
  • In June 2022, Molex, , has officially launched the Molex Quad-Row Board-to-Board Connectors. This connector series introduces an innovative staggered-circuit layout, resulting in a remarkable 30% reduction in space compared to conventional connector designs. With these patent-pending connectors, product developers and device manufacturers gain enhanced freedom and flexibility to accommodate compact form factors across a wide range of applications, including smartphones, smartwatches, wearables, game consoles, and Augmented Reality/Virtual Reality (AR/VR) devices.
  • In April 2022, TE Connectivity has launched new 369 series connector which is ideal for hard and confined environments. While retaining full compatibility with existing 369 connectors, the sealed panel mount connector from the 369 series introduces numerous enhanced features.
  • In December 2021, HIROSE Electric Co. Ltd. a manufacturer of cutting-edge connector solutions, has unveiled its BM46 Board-to-Board connectors. These connectors serve as an ideal solution for customers in search of compact-sized connectors that offer exceptional performance and reliable retention security.

Frequently Asked Questions (FAQ):

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TABLE OF CONTENTS
 
1 Introduction 
    1.1. Study Objectives  
    1.2. Market Definition and Scope 
           1.2.1. Inclusions and Exclusions
    1.3. Study Scope 
           1.3.1. Markets Covered
           1.3.2. Geographic Segmentation
           1.3.3. Years Considered for the study
    1.4. Currency 
    1.5. Limitations 
    1.6. Stakeholders 
    1.7. Impact of Recession 
 
2 Research Methodology 
    2.1. Research Data 
           2.1.1. Secondary Data
                    2.1.1.1. Major Secondary Sources
                    2.1.1.2. Key Data from Secondary Sources
           2.1.2. Primary Data
                    2.1.2.1. Primary Interviews with Experts
                    2.1.2.2. Key Data from Primary Sources
                    2.1.2.3. Key Industry Insights
                    2.1.2.4. Breakdown of Primaries
    2.2. Market Size Estimation 
           2.2.1. Bottom-Up Approach 
                    2.2.1.1. Approach for Capturing Market Share by Bottom-Up Analysis (Demand Side)
           2.2.2.  Top-Down Approach
                    2.2.2.1. Approach for Capturing Market Share by Top-Down Analysis (Supply Side)
    2.3. Market Breakdown and Data Triangulation 
    2.4. Research Assumptions 
    2.5. Risk Assessment 
    2.6. Assumptions of Recession 
    2.7. Limitations of Research 
 
3 Executive Summary 
 
4 Premium Insights 
 
5 Market Overview 
    5.1. Introduction 
    5.2. Market Dynamics 
    5.3. Value Chain Analysis 
    5.4. Ecosystem Analysis 
    5.5. Technology Analysis 
    5.6. Patent Analysis 
    5.7. Case Study Analysis 
    5.8. Trends Impacting Businesses of Market Players and Raw Material Suppliers 
    5.9. Trade Analysis 
    5.10. Porters Five Force Analysis 
           5.10.1. Threat from New Entrants
           5.10.2. Threat of Substitutes
           5.10.3. Bargaining Power of Suppliers
           5.10.4. Bargaining Power of Buyers
           5.10.5. Intensity of Competitive Rivalry
    5.11. Tariff and Regulatory Landscape 
           5.11.1. Regulatory Bodies, Government Agencies, and Other Organizations
    5.12. Key Stakeholders and Buying Criteria 
           5.12.1. Key Stakeholders in Buying Process
           5.12.2. Buying Criteria
    5.13. Pricing Analysis 
           5.13.1. Average Selling Prices of Key Players, By Hardware
           5.13.2. Average Selling Price Trend
    5.14. Key Conferences and Events (2023-2025) 
 
6 Board-to-Board Connector Market, By Type 
    6.1. Introduction 
    6.2. Pin Headers 
           6.2.1. Stacked Header
           6.2.2. Shrouded Header
    6.3. Socket 
 
7 Board-to-Board Connector Market, By Pitch 
    7.1. Introduction 
    7.2. Less than 1mm 
    7.3. 1mm to 2mm 
    7.4. Greater than 2mm 
 
8 Board-to-Board Connector Market, By End-user 
    8.1. Introduction 
    8.2. Consumer Electronics 
    8.3. Industrial Automation 
    8.4. Telecommunication 
    8.5. Automotive 
    8.6. Healthcare 
    8.7. Others (Aerospace & Defense, Transportation, Energy & Power) 
 
9 Board-to-Board Connector Market, By Region  
    9.1. Introduction 
    9.2. North America 
           9.2.1. Impact of Recession
           9.2.2. US
           9.2.3. Canada
           9.2.4. Mexico
    9.3. Europe 
           9.3.1. Impact of Recession
           9.3.2. UK
           9.3.3. Germany
           9.3.4. France
           9.3.5. Rest of Europe
    9.4. Asia Pacific 
           9.4.1. Impact of Recession
           9.4.2. China
           9.4.3. Japan
           9.4.4. South Korea
           9.4.5. Rest of Asia Pacific
    9.5. RoW 
           9.5.1. Impact of Recession
           9.5.2. Middle East & Africa
           9.5.3. South America
 
10 Board-to-Board Connector Market, Competitive Landscape 
     10.1. Market Evaluation Framework 
     10.2. Market Share Analysis, 2023 
     10.3. Five-Year Company Revenue Analysis 
     10.4. Company Evaluation Matrix 
             10.4.1. Star
             10.4.2. Emerging Leader
             10.4.3. Pervasive
             10.4.4. Participant
             10.4.5. Competitive Benchmarking
     10.5. Startups/SME Evaluation Matrix 
             10.5.1. Progressive Company
             10.5.2. Responsive Company
             10.5.3. Dynamic Company
             10.5.4. Starting Block
     10.6. Competitive Benchmarking 
     10.7. Company Footprint 
     10.8. Competitive Situation and Trends 
 
11 Board-to-Board Connector Market, Company Profiles  
     11.1. Key Players 
             11.1.1. TE Connectivity
             11.1.2. HARTING Technology
             11.1.3. Amphenol Corporation
             11.1.4. Molex
             11.1.5. CSCONN Corporation
             11.1.6. Omron Corporation
             11.1.7. Samtec
             11.1.8. FIT Hon Teng
             11.1.9. Kyocera Corporatioon
             11.1.10. Hirose
             11.1.11. Japan Aviation Electronics (JAE)
     11.2. Other Players 
             11.2.1. 3M
             11.2.2. ERNI Deutschland GmbH
             11.2.3. Harwin
             11.2.4. ept GmbH
             11.2.5. KEL Corporation
             11.2.6. METZ CONNECT
             11.2.7. SMK Corporation
             11.2.8. ACES Electronics
             11.2.9. AirBorn
             11.2.10. AUK Connector
             11.2.11. Rosenberger
             11.2.12. JST Sales America
             11.2.13. Phoenix Contact
             11.2.14. IRISO Electronics
             11.2.15. Yamaichi Electronics
 
12 Appendix 
     12.1. Discussion Guide 
     12.2. Knowledge Store: MarketsandMarkets’ Subscription Portal 
     12.3. Available Customizations 
     12.4. Related Reports 
     12.5. Author Details 
 
13 Key Players in Industrial Automation (Customization) 
     13.1. Rockwell, Emerson, Eaton, Siemens, ABB, Parker Hannifin (company details, revenue, products offered and recent developments) 
Note: The current table of contents is tentative and is subject to change as we progress with our research.  
 

To estimate the size of the board-to-board connectors market, the study utilized four major activities. Exhaustive secondary research was conducted to gather information on the market, as well as its peer and parent markets. The next step was to validate these findings, assumptions, and sizing with industry experts across the value chain through primary research. Both top-down and bottom-up approaches were employed to estimate the total market size. Finally, market breakdown and data triangulation methods were utilized to estimate the market size for different segments and subsegments.

Secondary Research

In the secondary research process, various sources have been referred to for identifying and collecting information for this study on the board-to-board connectors market. Secondary sources for this research study include corporate filings (such as annual reports, investor presentations, and financial statements); trade, business, and professional associations; white papers; certified publications; articles by recognized authors; directories; and databases. The secondary data was collected and analyzed to determine the overall market size, further validated through primary research.

List of key secondary sources

SOURCE NAME

WEBLINK

International Federation of Robotics

https://ifr.org/

International Trade Centre (ITC)

www.intracen.org

World Economic Forum

https://www.weforum.org/

World Trade Organization

www.wto.gov

Semiconductor Equipment and Material (SEMI)

https://www.semi.org/

Primary Research

To gather insights on market statistics, revenue data, market breakdowns, size estimations, and forecasting, primary interviews were conducted. Additionally, primary research was used to comprehend the various technology, application, vertical, and regional trends. Interviews with stakeholders from the demand side, including CIOs, CTOs, CSOs, and customer/end-user installation teams using board-to-board connectors, were also conducted to understand their perspective on suppliers, products, component providers, and their current and future use of board-to-board connectors, which will impact the overall market. Several primary interviews were conducted across major countries of North America, Europe, Asia Pacific, the Middle East & Africa, and Latin America.

Board-to-Board Connectors Market Size, and Share

To know about the assumptions considered for the study, download the pdf brochure

Market Size Estimation

To estimate and validate the size of the board-to-board connectors market and its submarkets, both top-down and bottom-up approaches were utilized. Secondary research was conducted to identify the key players in the market, and primary and secondary research was used to determine their market share in specific regions. The entire process involved studying the annual and financial reports of top players and conducting extensive interviews with industry leaders such as CEOs, VPs, directors, and marketing executives. Secondary sources were used to determine all percentage shares and breakdowns, which were then verified through primary sources. All parameters that could impact the markets covered in this research study were accounted for, analyzed in detail, verified through primary research, and consolidated to obtain the final quantitative and qualitative data.

Global Board-To-Board Connectors Market Size: Botton Up Approach

  • Identifying various board-to-board connectors components
  • Analyzing the penetration of each component through secondary and primary research
  • Analyzing integration of board-to-board connectors in different applications through secondary and primary research
  • Conducting multiple discussions with key opinion leaders to understand the detailed working of board-to-board connectors and their implementation in multiple applications; this helped analyze the break-up of the scope of work carried out by each major company
  • Verifying and cross-checking the estimates at every level with key opinion leaders, including CEOs, directors, operation managers, and finally with the domain experts at MarketsandMarkets
  • Studying various paid and unpaid sources of information, such as annual reports, press releases, white papers, and databases

Board-to-Board Connectors Market Size, and Botton Up Approach

Global Board-To-Board Connectors Market Size: Top Down Approach

The top-down approach has been used to estimate and validate the total size of the board-to-board connectors market.

  • Focusing initially on the R&D investments and expenditures being made in the ecosystem of the board-to-board connectors market; further splitting the market on the basis of type, pitch, application, and region and listing the key developments
  • Identifying leading players in the board-to-board connectors market through secondary research and verifying them through brief discussions with industry experts
  • Analyzing revenue, product mix, geographic presence, and key applications for which products are served by all identified players to estimate and arrive at percentage splits for all key segments
  • Discussing splits with industry experts to validate the information and identify key growth pockets across all key segments
  • Breaking down the total market based on verified splits and key growth pockets across all segments

Board-to-Board Connectors Market Size, and Top Down Approach

Data Triangulation

Once the overall size of the board-to-board connectors market was determined using the methods described above, it was divided into multiple segments and subsegments. Market engineering was performed for each segment and subsegment using market breakdown and data triangulation methods, as applicable, to obtain accurate statistics. To triangulate the data, various factors and trends from the demand and supply sides were studied. The market was validated using both top-down and bottom-up approaches.

Market Definition

Board-to-board connectors are essential components used to connect printed circuit boards (PCBs) within electronic devices and systems. These connectors serve as vital links between PCBs, enabling the transfer of electrical signals, power, and data among different boards, modules, or components. They are widely employed across various industries such as consumer electronics, automotive, telecommunications, industrial automation, medical devices, and energy and power. To meet diverse application requirements, these connectors incorporate different technologies like through-hole, surface-mount, press-fit, or a combination thereof. Their primary function is to ensure seamless and reliable electrical connections between PCBs, guaranteeing proper signal integrity, mechanical stability, and electrical performance. As digital communication continues to grow rapidly, there is an increasing need for high-speed data transmission in different sectors.

Key Stakeholders

  • Logistics and shipment companies
  • Board-to-board connectors providers
  • Product distributors
  • Technology investors
  • Governments and financial institutions
  • Research organizations
  • Analysts and strategic business planners
  • Venture capitalists, private equity firms, and start-ups

Report Objectives

  • To define, describe, and forecast the board-to-board connectors market based on type, pitch, application, and region.
  • To forecast the shipment data of board-to-board connectors market based on offerings.
  • To forecast the size of the market segments for four major regions—North America, Europe, Asia Pacific (APAC), and the Rest of the World (RoW)
  • To provide detailed information regarding the major factors influencing the growth of the market (drivers, restraints, opportunities, and challenges)
  • To strategically analyze micro markets with respect to individual growth trends, prospects, and contributions to the total market
  • To study the complete value chain and allied industry segments and perform a value chain analysis of the market.
  • To strategically profile the key players and comprehensively analyze their market shares and core competencies.
  • To analyze the opportunities in the market for stakeholders and describe the competitive landscape of the market.
  • To analyze competitive developments such as joint ventures, collaborations, agreements, contracts, partnerships, mergers & acquisitions, product developments, and research & development (R&D) in the market
  • To analyze the impact of the recession on the board-to-board connectors market

Available customizations:

With the given market data, MarketsandMarkets offers customizations according to the specific requirements of companies. The following customization options are available for the report:

  • Detailed analysis and profiling of additional market players (up to 5)
  • Additional country-level analysis of the board-to-board connectors market

Product Analysis

  • Product matrix, which provides a detailed comparison of the product portfolio of each company in the board-to-board connectors market.
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Report Code
SE 8727
Published ON
Jul, 2023
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